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 HiPerFETTM Power MOSFETs
N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low trr
Preliminary data
Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR dv/dt PD TJ TJM Tstg TL Md Weight 1.6 mm (0.063 in) from case for 10 s Mounting torque Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 MW Continuous Transient TC = 25C TC = 25C, pulse width limited by TJM TC = 25C TC = 25C IS IDM, di/dt 100 A/ms, VDD VDSS, TJ 150C, RG = 2 W TC = 25C 72N20 80N20 72N20 80N20
VDSS IXFK72N20 IXFK80N20
ID25
RDS(on)
200 V 72 A 35 mW 200 V 80 A 30 mW trr 200 ns
Maximum Ratings 200 200 20 30 72 80 288 320 74 45 5 360 -55 ... +150 150 -55 ... +150 300 0.9/6 10 V V V V A A A A A mJ V/ns W C C C C Nm/lb.in. g
TO-264 AA
G D S
(TAB)
G = Gate S = Source
D = Drain TAB = Drain
Features * International standard packages * Molding epoxies meet UL 94 V-0 flammability classification * Low RDS (on) HDMOSTM process * Unclamped Inductive Switching (UIS) rated * Fast intrinsic rectifier
Applications Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 200 2 4 100 TJ = 25C TJ = 125C 200 1 35 30 V V nA mA mA mW mW * * * * DC-DC converters Synchronous rectification Battery chargers Switched-mode and resonant-mode power supplies * DC choppers * Temperature and lighting controls
VDSS VGS(th) IGSS IDSS RDS(on)
VGS = 0 V, ID = 1 mA VDS = VGS, ID = 4 mA VGS = 20 VDC, VDS = 0 VDS = 0.8 * VDSS VGS = 0 V VGS = 10 V,ID = 0.5 * ID25
Advantages * Easy to mount * Space savings * High power density
72N20 80N20 Pulse test, t 300 ms, duty cycle d 2 %
IXYS reserves the right to change limits, test conditions, and dimensions.
97523C (07/00)
(c) 2000 IXYS All rights reserved
1-4
IXFK72N20
Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 35 42 5900 VGS = 0 V, VDS = 25 V, f = 1 MHz 1140 480 40 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 55 120 26 280 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 39 120 0.35 0.15 RG = (External), S pF pF pF ns ns ns ns nC nC nC K/W K/W
Dim. A A1 A2 b b1 b2 c D E e J K L L1 P Q Q1 R R1 S T
IXFK80N20
TO-264 AA Outline
gfs Ciss Coss Crss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCK
VDS
= 10 V; ID = 0.5 * ID25, pulse test
Millimeter Min. Max. 4.82 2.54 2.00 1.12 2.39 2.90 0.53 25.91 19.81 5.46 0.00 0.00 20.32 2.29 3.17 6.07 8.38 3.81 1.78 6.04 1.57 5.13 2.89 2.10 1.42 2.69 3.09 0.83 26.16 19.96 BSC 0.25 0.25 20.83 2.59 3.66 6.27 8.69 4.32 2.29 6.30 1.83
Inches Min. Max. .190 .202 .100 .114 .079 .083 .044 .056 .094 .106 .114 .122 .021 .033 1.020 1.030 .780 .786 .215 BSC .000 .010 .000 .010 .800 .820 .090 .102 .125 .144 .239 .247 .330 .342 .150 .170 .070 .090 .238 .248 .062 .072
Source-Drain Diode Symbol IS ISM VSD t rr QRM IRM Test Conditions VGS= 0 V
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 72N20 80N20 72N20 80N20 72 80 288 320 1.5 A A A A V
Repetitive; pulse width limited by TJM
IF = IS, VGS = 0 V, Pulse test, t 300 ms, duty cycle d 2 % IF = IS, -di/dt = 100 A/ms, VR = 100 V 1.2 10
200
ns mC A
(c) 2000 IXYS All rights reserved
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
2-4
IXFK72N20
IXFK80N20
200
TJ = 25OC
160
VGS = 10V 9V 8V
200
TJ = 125OC
160
VGS = 10V 9V 8V
ID - Amperes
120 80 40
5V
ID - Amperes
7V
120
7V
6V
80 40
6V
5V
0
0
4
8
12
16
20
0
0
4
8
12
16
20
VDS - Volts
VDS - Volts
O
Figure 1. Output Characteristics at 25 C
Figure 2. Output Characteristics at 125OC
2.4
3.2
VGS = 10V
VGS = 10V
RDS(ON) - Normalized
RDS(ON) - Normalized
2.8 2.4 2.0 1.6 1.2 0.8
T j =250 C Tj = 1250 C
2.0
ID = 80A
1.6
ID = 40A
1.2
0
50
100
150
200
250
0.8 25
50
75
100
125
150
ID - Amperes
TJ - Degrees C
Figure 3. RDS(on) normalized to 0.5 ID25 value
100 80 IXFK80N20 IXFK72N20
Figure 4. RDS(on) normalized to 0.5 ID25 value
160
120
ID - Amperes
60 40 20 0 -50
ID - Amperes
TJ = 25 C
o
TJ = 125oC
80
40
0 -25 0 25 50 75 100 125 150
2
4
6
8
10
TC - Degrees C
VGS - Volts
Figure 5. Drain Current vs. Case Temperature
Figure 6. Admittance Curves
(c) 2000 IXYS All rights reserved
3-4
IXFK72N20
12 10
VDS = 100 V ID = 40 A IG = 1 mA
IXFK80N20
10000
Ciss
Capacitance - pF
VGS - Volts
8 6 4 2 0
f = 1MHz
1000
Coss
Crss
100 0 50 100 150 200 250 300 350
0
5
10
15
20
25
30
35
40
Gate Charge - nC
VDS - Volts
Figure 7. Gate Charge
200 160 300
Figure 8. Capacitance Curves
1 00
ID - Amperes
120
TJ = 25OC
ID - Amperes
80
TJ = 125OC
10 TC = 25OC
1 ms 10 ms 100 ms DC
40
0 0.4
0.8
1.2
1.6
2.0
1 1 10 1 00 200
VSD - Volts
VDS - Volts
Figure 9. Source Current vs. Source to Drain Voltage
0.40 0.35 0.30
Figure10. Forward Bias Safe Operating Area
R(th)JC - K/W
0.25 0.20 0.15 0.10 0.05 0.00 10-3 10-2 10-1 100 101
Pulse Width - Seconds
Figure 11. Transient Thermal Resistance
(c) 2000 IXYS All rights reserved
4-4


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